Display assembly using structural adhesive

ABSTRACT

A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/669,439 filed Feb. 11, 2022, which claims the benefit of U.S.Provisional Application Ser. No. 63/148,703 filed Feb. 12, 2021, thedisclosures of which are hereby incorporated by reference as if fullyrested herein.

TECHNICAL FIELD

Exemplary embodiments relate generally to display assemblies usingstructural adhesive and methods of manufacture related to the same.

BACKGROUND AND SUMMARY OF THE INVENTION

The use of electronic displays, such as for advertising, in theout-of-home market has increased in popularity over recent years. Beinglocated outdoors, such electronic displays are frequently exposed toharsh conditions, including, but not limited to, solar loading, extremetemperatures, precipitation, moisture, contaminants, vandalism,wildlife, and the like. To protect the electronic displays and otherassociated sensitive components from such harsh conditions, it is knownto place the electronic displays in ruggedized housings. Such housingsmay fully or partially seal the electronic displays and other associatedsensitive components.

Fasteners are typically used to attach components of, or associatedwith, such ruggedized housings. The use of fasteners introducespotential leak points and requires additional parts and manufacturingtime. Sometimes, welding is used to join components, but welding is notavailable for all types of material and can be time and labor intensiveto use. Furthermore, welding can introduce distortion which can affectoptical quality of displayed images.

Display assemblies which comprise structural adhesive, and methods ofmanufacture related to the same, are provided. In exemplary embodiments,the structural adhesive is used in place of at least some of thefasteners. The use of such structural adhesive may provide a number ofbenefits, at least some of which are unexpected. For example, withoutlimitation, use of the structural adhesive, particularly in place offasteners, may provide flatter surfaces. Especially in the case ofcomponents attached, directly or indirect to, the electronic displaylayer, any diffusion panels, cover panels, films, filters, and the like,such flatter surfaces may improve optics and/or may provide bettersealing between subassemblies and/or components. As another example,again without limitation, the use of such structural adhesive mayprovide for a stiffer and/or stronger assembly. This may improvelongevity and/or reduced vibrations. As yet another example, withoutlimitation, the use of such structural adhesive may improve dimensionalaccuracy, resulting in better thermal conduction and/or the ability toadd extra components. Display assemblies using such structural adhesivemay enjoy reduced noise emission and reduced power consumption (e.g., byreducing thermal management needs and/or improving airflow) to name afew examples. The use of such structural adhesive may also reduce thenumber of parts required, manufacturing time, manufacturing costs,combinations thereof, or the like. Furthermore, the use of structuraladhesive in place of fasteners may reduce potential leak points.

The same of different structural adhesive may be used at variouslocations of the display assembly. For example, the structural adhesivemay be used to manufacture specific components, join specific parts,combinations thereof, or the like. In exemplary embodiments, thestructural adhesive comprises methyl methacrylate (hereinafter also“MMA”), though any type or kind of adhesive may be utilized. Thestructural adhesive may comprise a spacing material, such as, but notlimited to, glass beads in exemplary embodiments. The spacing materialmay ensure that a desired amount of structural adhesive remains betweentwo compressed parts and may provide for consistent tolerancing.

In exemplary embodiments, without limitation, the structural adhesivemay be used to manufacture a thermal management substructure for thedisplay assembly. The thermal management substructure may comprise oneor more heat exchangers, at least some of which may comprise multiplelayers. In exemplary embodiments, the thermal management substructurecomprises a first heat exchange substructure. The first heat exchangesubstructure may comprise a single or multiple layer heat exchanger. Thefirst heat exchange substructure may be configured to accommodateambient air in exemplary embodiments, without limitation. The first heatexchange substructure may form part of an open loop airflow pathway forambient air when secured within the display assembly by way ofnon-limiting example. For example, without limitation, the structuraladhesive may be applied along ridges and/or troughs of a corrugatedlayer of the first heat exchange substructure to secure the corrugatedlayer to front and/or rear panels of the first heat exchangesubstructure. The first heat exchange substructure may, in exemplaryembodiments, without limitation, be provided, directly or indirectly,along a rear surface of a backlight for an electronic display layer andmay be configured, at least in part, to remove heat generated by thebacklight.

Alternatively, or additionally, the thermal management substructure maycomprise a second heat exchange substructure. The second heat exchangesubstructure may comprise a multi-layer heat exchanger. The second heatexchange substructure may be configured to accommodate both ambient airand circulating gas in exemplary embodiments, without limitation. Thesecond heat exchange substructure may be configured to form part of anopen loop airflow pathway for ambient air and a closed loop airflowpathway for circulating gas when installed within the display assembly,by way of non-limiting example. The structural adhesive may be appliedat the second heat exchange substructure, such as to form the same. Thesecond heat exchange substructure may comprise multiple layers. Forexample, without limitation, the structural adhesive may be appliedbetween one or more layers of the second heat exchange substructure,such as, but not limited to, at the layers themselves, at spacingmembers, and/or at connecting members extending between the layers, tosecure such layers to each other, to a front and/or rear panel, and/orto other components of the assembly. The second heat exchangesubstructure may, in exemplary embodiments, be provided rearward of thefirst heat exchange substructure. The second heat exchange substructuremay form part of an open loop airflow pathway for ambient air and partof a closed loop airflow pathway for circulating gas. The second heatexchange substructure may be configured to move heat from thecirculating gas to the ambient air.

The ambient air within the open loop airflow pathway may be entirely orsubstantially prevented from mixing with the circulating gas of theclosed loop airflow pathway. For example, without limitation, thedisplay assembly may be configured to comply with various ingressprotection standards, such as, but not limited to, IP 65, IP 66, IP 67,IP 68, combinations thereof, or the like.

For example, without limitation, in the case of a display assembly foran 86″ display, the use of such structural adhesive may replace as manyas 300 fasteners, if not more. Some or all components of the displayassembly may be devoid of fasteners, by way of non-limiting example.

Further features and advantages of the systems and methods disclosedherein, as well as the structure and operation of various aspects of thepresent disclosure, are described in detail below with reference to theaccompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

In addition to the features mentioned above, other aspects of thepresent invention will be readily apparent from the followingdescriptions of the drawings and exemplary embodiments, wherein likereference numerals across the several views refer to identical orequivalent features, and wherein:

FIG. 1 is a front view of a display assembly indicating section lineA-A;

FIG. 2A is a detailed side sectional view of the display assembly ofFIG. 1 taken along section line A-A and indicating detail A;

FIG. 2B is a detailed perspective view of detail A of FIG. 2A;

FIG. 3A is a perspective view of a second heat exchange substructureusing fasteners for use with the display assembly of FIG. 1 indicatingdetail B;

FIG. 3B is a detailed perspective view of detail B of FIG. 3A;

FIG. 4A is a perspective view of an exemplary second heat exchangesubstructure using structural adhesive for use with the display assemblyof FIG. 1 and indicating detail C;

FIG. 4B is a detailed perspective view of detail C of FIG. 4A;

FIG. 5A is a perspective view of a first heat exchange substructureusing fasteners for use with the display assembly of FIG. 1 alsoindicating details D and F, as well as section line B-B;

FIG. 5B is a perspective view of a first heat exchange substructureusing structural adhesive for use with the display assembly of FIG. 1also indicating details E and G, as well as section line C-C;

FIG. 6A is a detailed perspective view of detail D of FIG. 5A;

FIG. 6B is a detailed perspective view of detail E of FIG. 5B;

FIG. 7A is another detailed perspective view of detail F of FIG. 5A;

FIG. 7B is another detailed perspective view of detail G of FIG. 5B;

FIG. 8A is a cross sectional perspective view taken along section lineB-B of FIG. 5A;

FIG. 8B is a cross sectional perspective view taken along section lineC-C of FIG. 5B;

FIG. 9 is a flow chart for an exemplary process for creating the displayassembly, or subassemblies thereof, using structural adhesive;

FIG. 10 is a perspective view of an exemplary first heat exchangesubstructure partially completed and undergoing manufacture; and

FIG. 11 is a rear view of an exemplary portion of the housing of theassembly of FIG. 1 .

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENT(S)

Various embodiments of the present invention will now be described indetail with reference to the accompanying drawings. In the followingdescription, specific details, such as detailed configuration andcomponents, are merely provided to assist the overall understanding ofthese embodiments of the present invention. Therefore, it should beapparent to those skilled in the art that various changes andmodifications of the embodiments described herein can be made withoutdeparting from the scope and spirit of the present invention. Inaddition, descriptions of well-known functions and constructions areomitted for clarity and conciseness.

Embodiments of the invention are described herein with reference toillustrations of idealized embodiments (and intermediate structures) ofthe invention. As such, variations from the shapes of the illustrationsas a result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments of the invention should not beconstrued as limited to the particular shapes of regions illustratedherein but are to include deviations in shapes that result, for example,from manufacturing.

FIG. 1 through FIG. 2B illustrate an exemplary display assembly 10. Theassembly 10 may comprise a housing 18. The assembly 10 may comprise acover layer 12. The cover layer 12 may comprise a single layer ormultiple layers 12A, 12B bonded together, such as by way of an opticaladhesive. The cover layer 12 may be positioned forward of an electronicdisplay layer 14. The cover layer 12 may be secured to the housing 18,directly or indirectly. The electronic display layer 14 may be securedto the housing 18, directly or indirectly. The electronic display layer14 may comprise a layer of liquid crystals (e.g., an LCD), a plasmadisplay, OLED display, LED display, combinations thereof, or the like.

The cover layer 12 may be transparent or translucent such that imagesdisplayed at the electronic display layer 14 are visible to an intendedviewer through the cover layer 12. The cover layer 12 may comprise oneor more polarizers, anti-reflective films, surface treatments,combinations thereof, or the like. The cover layer 12 may be configuredto protect and/or enhance optics of the images displayed at theelectronic display layer 14. A front gap 13 may extend between the coverlayer 12 and the electronic display layer 14. The front gap 13 comprisesa channel which may form part of a closed loop airflow pathway forcirculating gas. Alternatively, the cover layer 12 may be opticallybonded to the electronic display layer 14.

A backlight 16 may be provided rearward of the electronic display layer14. In exemplary embodiments, the backlight 16 may comprise multiplelight emitting diodes (LEDs) or other light sources configured toilluminate the electronic display layer 14 when powered. The backlight16 may comprise multiple light sources mounted to one or more panels 24.The backlight 16 may comprise multiple tiles or blocks of light sources,each of which may be connected to a power source and/or a driver, whichmay be individual to the tile or block or common to multiple tiles orblocks. In exemplary embodiments, the backlight 16 may be configured toprovide direct backlighting to the electronic display layer 14. In otherexemplary embodiments, the backlight 16 may be configured to provideedge lighting to the electronic display layer 14, such as directly, orby way of one or more diffusers, reflection elements, combinationsthereof, or the like. Where emissive type electronic display layers 14are utilized, a separate backlight 16 may not be required.

The assembly 10 may comprise one or more thermal managementsubstructures, including, but not necessarily limited to, a first heatexchange substructure 20. The first heat exchange substructure 20 maycomprise a single or multiple layer heat exchanger, by way ofnon-limiting example. The first heat exchange substructure 20 may beprovided rearward of the backlight 16 and/or the electronic displaylayer 14. In exemplary embodiments, the first heat exchange substructure20 may extend, directly or indirectly, along some or all of thebacklight 16 and/or electronic display layer 14 so as to absorb some orall of the heat generated by the backlight 16 and/or electronic displaylayer 14 when in use. The first heat exchange substructure 20 may extenddirectly along a rear panel of the backlight 16, though such is notrequired. For example, without limitation, the panel 24 may form aportion of the first heat exchange substructure 20, though spacingand/or other layers between the panel 24 and the first heat exchangesubstructure 20 may be provided.

The first heat exchange substructure 20 may comprise a corrugated layer26. The corrugated layer 26 may comprise a single sheet of material bentto form peaks and valleys in exemplary embodiments. The corrugated layer26 may comprise multiple sheets, panels, portions, and/or subcomponentswhich together form the corrugated layer 26. The corrugated layer 26 maycomprise a zig-zag pattern which extends between two or more panels,thereby forming a number of subchannels or pathways, such as which arepart of a larger channel or pathway. Alternatively, or additionally, thefirst heat exchange substructure 20 may comprise a number of tubes(e.g., square, rectangular, round, combinations thereof, or the like).The corrugated layer 26 may be secured to the panel 24, though such isnot required. In other exemplary embodiments, without limitation, thecorrugated layer 26 may be secured to another panel of the first heatexchange substructure 20 separate from the panel 24 and forming part ofthe backlight 16. The first heat exchange substructure 20 may comprise asecond panel 28. The corrugated layer 26 and/or channels may extendbetween two panels of the first heat exchange substructure 20 to formpassageways. Where the corrugated layer 26 comprises multiple parts,each part may be secured to the panel 24, second panel 28, and/or othercomponent(s), by way of non-limiting example.

The first heat exchange substructure 20 may form part of an open loopairflow pathway configured to accept ambient air. In exemplaryembodiments, the first heat exchange substructure 20 may be in fluidcommunication with one or more intakes and exhausts provided in thehousing 18. Such intakes and exhausts may comprise one or moreapertures.

The thermal management substructure of the assembly 10 may compriseother components, including, but not necessarily limited to, a secondheat exchange substructure 22. The second heat exchange substructure 22may comprise a multi-layer heat exchanger, by way of non-limitingexample. The second heat exchange substructure 22 may be providedrearward of the backlight 16 and/or electronic display layer 14. Inexemplary embodiments, the second heat exchange substructure 22 may beprovided rearward of the first heat exchange substructure 20.

The second heat exchange substructure 22 may comprise multiple layers36, at least some of which may form part of a same or a different openloop airflow pathway as the first heat exchange substructure 20, and atleast some of which may form part of the same or a different closed loopairflow pathway as the front gap 13. Notably, the front gap 13 may notbe required. The closed loop airflow pathway may extend within thehousing 18. The second heat exchange substructure 22 may be in fluidcommunication with the same or different intakes and exhausts as thefirst heat exchange substructure 20. The second heat exchangesubstructure 22 may be in fluid communication with the front gap 13,though such is not required. The first and second heat exchangesubstructures 20, 22 may be mechanically separated from, or connectedto, one another.

In exemplary embodiments, the display assembly 10 may comprise multipleelectronic display layers 14. In such embodiments, the display assembly10 may comprise multiple cover layers 12, backlights 16, first heatexchange substructure 20, second heat exchange substructure 22,combinations thereof, or the like. However, at least the second heatexchange substructure 22 may be common to multiple electronic displaylayers 14 in some embodiments. For example, without limitation, thedisplay assembly 10 may comprise a first and second electronic displaylayer 14 provided in a back-to-back arrangement, such as with front gaps13 fluidly connected to a common second heat exchange substructure 22but which each utilize separate first heat exchange substructures 20,one for each electronic display layer 14 for example, withoutlimitation. Such an arrangement is not required. Any number and/orarrangement of open loop airflow pathways, sub-pathways, channels,subchannels, or the like may be provided. Alternatively, oradditionally, any number and/or arrangement of closed loop airflowpathways, sub-pathways, channels, subchannels, or the like may beprovided. Any number and type of first heat exchange substructures 20and/or second heat exchange substructures 22 may be provided. Forexample, one or more of the first heat exchange substructure 20 and/orsecond heat exchange substructure 22 may be used within the displayassembly 10. Any number or type of electronic display layers 14 may beutilized which may share some or all parts of a thermal managementsubstructure, or have entirely separate thermal managementsubstructures.

In embodiments where the electronic display layer 14 self-illuminates,for example, without limitation, where the electronic display layer 14comprises plasma, OLED, LEDs, combinations thereof, or the like, aseparate backlight 16 may not be required. In such embodiments, thefirst heat exchange substructure 20, if utilized, may be provided alongsome or all of the electronic display layer 14.

The assembly 10 may comprise one or more fans. Some of the fans may beprovided within the open loop airflow pathways for moving ambient airwhen activated. Other of the fans may be provided within the closed loopairflow pathways for moving circulating gas when activated. In otherexemplary embodiments, fans may be common to both the open and closedloop airflow pathways.

The ambient air within the open loop airflow pathway may be entirely orsubstantially prevented from mixing with the circulating gas of theclosed loop airflow pathway. For example, without limitation, thedisplay assembly may be configured to comply with various ingressprotection standards, such as, but not limited to, IP 65, IP 66, IP 67,IP 68, combinations thereof, or the like. Ambient air may comprise airingested from the surrounding environment and may be filtered. Thecirculating gas may comprise air kept fully or partially separate fromthe ambient air. For example, the circulating gas may be ambient airtrapped when the assembly 10 is formed or otherwise periodicallyaccessed (e.g., for servicing). Alternatively, or additionally, thecirculating gas may comprise filtered or purified air.

The first heat exchange substructures 20 and/or second heat exchangesubstructures 22 may be configured to facilitate such separation. Thefirst heat exchange substructures 20 and/or second heat exchangesubstructures 22 may be of any type, including, but not limited to,cross flow, counter flow, co-current, counter current, hybrid, direct,indirect, parallel flow, shell and tube, tube in tube, double tube,plate type heat exchangers, combinations thereof, or the like.Alternatively, or additionally, one or both of the first heat exchangesubstructures 20 and/or second heat exchange substructures 22 may beconfigured to mix air between the open and closed loops and may comprisea mixing chamber, by way of non-limiting example.

FIG. 3A and FIG. 3B illustrate an embodiment of the second heat exchangesubstructure 22A using fasteners 34. The second heat exchangesubstructure 22A may comprise a number of layers 36. Some of the layers36 may form part of one or more of the open loop airflow pathways forambient air, and some others may form part of one or more of the closedloop airflow pathways for circulating gas. For example, withoutlimitations, the layers 36 may be configured to alternately acceptambient air and circulating gas on a layer-by-layer basis. The secondheat exchange substructure 22A may comprise one or more panels 30, suchas, but not limited to, a front and rear panel. One or more members 32may extend between the panels 30 and/or along some or all of the layers36. Such members 32 may be spaced apart along some or all of the secondheat exchange substructure 22A. Such members 32 may, alternatively oradditionally, be provided between layers 36 to space the layers 36apart. The second heat exchange substructure 22A may comprise a numberof fasteners 34 provided on the panel(s) 30, the layer(s) 36, and/or themembers 32. The fasteners 34 may penetrate through one or more of thepanels 30, the layers 36, and/or the members 32. The fasteners 34 maycomprise screws, rivets, bolts, nails, combinations thereof, or thelike.

Significant compressive force may be provided at or adjacent to thefasteners 34 as a result of torquing during installation of thefasteners 34. However, moving further from the fasteners 34, lesscompressive force may be provided as a result of torquing duringinstallation of the fasteners 34. This may result in uneven surfaces,inadequate sealing, less structural rigidity, combinations thereof, andthe like of the assembly 10 or components thereof.

FIG. 4A and FIG. 4B illustrates another embodiment of the second heatexchange substructure 22B using structural adhesive. The second heatexchange substructure 22B may have the same, or similar, componentsarranged in the same or similar manner as the second heat exchangesubstructure 22A, though such is not required. Fewer or no fasteners 34may be utilized compared to the second heat exchange substructure 22B.Instead of some or all of the fasteners 34, a structural adhesive may beutilized with the second heat exchange substructure 22B. In exemplaryembodiments, the structural adhesive may be provided between each layer36, at the members 32, at the panels 30A, 30B, combinations thereof, orthe like. The structural adhesive may, alternatively or additionally, beprovided on outer portions of the second heat exchange substructure 22Bto connect the second heat exchange substructure 22B to other componentsof the display assembly 10, such as, but not limited to, the panel 24,the second panel 24B, the housing 18, the first heat exchangesubstructure 20A, 20B, the backlight 16, a structural member, othercomponent, combinations thereof, or the like.

The open loop airflow pathway for the second heat exchange substructure22B may be at least partially separated from the open loop airflowpathway for the first heat exchange substructure 20B. For example,without limitation, ambient air may be ingested through separate intakesand exhausted through separate exhausts. As another example, withoutlimitation, ambient air may be ingested through a common intake andseparated so that a first portion travels through a first open loopairflow pathway to the first heat exchange substructure 20B and a secondportion travels through a second open loop airflow pathway to the secondheat exchange substructure 22B before being exhausted through separate,or common, exhausts.

Multiple second heat exchange substructures 22B may be utilized in adisplay assembly 10 and/or a single second heat exchange substructure22B may be broken up into portions or sections.

FIG. 5A, FIG. 6A, FIG. 7A, and FIG. 8A illustrate an embodiment of thefirst heat exchange substructure 20A using fasteners 34. The fasteners34 may be provided along peaks and/or valleys of the corrugated layer26. Multiple corrugated layers 26 may be provided, such as adopt oneanother, adjacent to one another, combinations thereof, or the like.Alternatively, or additionally, the corrugated layers 26 may be providedin multiple portions. The fasteners 34 may extend through front or rearpanels of the first heat exchange substructure 20A and/or to the panel24, the second panel 28, the backlight 16, the housing 18, structuralmember, other component, combinations thereof, or the like.

Significant compressive force may be provided at or adjacent to thefasteners 34 as a result of torquing the fasteners 34 duringinstallation. However, moving further from the fasteners 34, lesscompressive forces may be provided. This may result in uneven surfaces,inadequate sealing, less structural rigidity, combinations thereof, andthe like.

FIG. 5B, FIG. 6B, FIG. 7B, and FIG. 8B illustrate an embodiment of thefirst heat exchange substructure 20B using structural adhesive. Thefirst heat exchange substructure 20B may have the same, or similar,components arranged in the same or similar manner to the first heatexchange substructure 20A, though such is not required. However, feweror no fasteners 34 may be utilized. Instead of some or all of thefasteners 34, the structural adhesive may be utilized. In exemplaryembodiments, the structural adhesive may be provided along the peaksand/or valleys of the corrugated layer 26.

The structural adhesive may connect the corrugated layer 26 to frontand/or rear panels of the first heat exchange substructure 20B, such as,but not limited to, the panel 24, the second panel 28, combinationsthereof, or the like. The structural adhesive may be provided on outersurfaces of the first heat exchange substructure 20B to connect thefirst heat exchange substructure 20B to other components of the displayassembly 10 such as, but not limited to, the second heat exchangesubstructure 22A, 22B, the backlight 16, the housing 18, structuralmember, other component, combinations thereof, or the like.

FIG. 9 explains how the assembly 10, or components thereof, such as, butnot limited to, the first heat exchange substructure 20B and/or thesecond heat exchange substructure 22B may be created or otherwisepartially or fully manufactured using the structural adhesive. FIG. 10provides an example of a portion of the assembly 10, and specifically ofan exemplary first heat exchange substructure 20B, partially assembled.The process shown and/or described herein may be utilized for any numberof components of the assembly 10, including, but not limited to, thesecond heat exchange substructure 22B.

The structural adhesive may be prepared. Preparation of the structuraladhesive may include mixing one or more materials. The structuraladhesive may comprise a pressure sensitive adhesive. The pressuresensitive adhesive (“PSA”) may be a natural rubber PSA, synthetic rubberPSA, acrylic PSA, silicon PSA, combinations thereof, or the like. Othertypes or kinds of adhesives may alternatively, or additionally, beutilized. The adhesive or other portion of the structural adhesive maycomprise multiple parts which require mixing before application.

The adhesive or other portion of the structural adhesive may be mixedwith, or otherwise include, a spacing material. The spacing material maycomprise an inert material. For example, without limitation, the spacingmaterial may comprise glass beads of a particular size, such as, but notlimited to, 10/1000ths of an inch, though any size or multiple sizes maybe used, such as, but not limited to, between 1/1000ths of an inch and100/1000ths of an inch. The utilizing of a spacing material as part of,or with, the structural adhesive may provide the necessary gap betweencomponents for the adhesive to remain and activate application. Forexample, without the spacing material the adhesive may otherwise bedisplaced upon sufficient compression of the components. The spacingmaterial may, alternatively, or additionally, be utilized to provideincreased dimensional accuracy of the resulting subassemblies and/ordisplay assembly 10 by providing more exact and consistent spacingbetween adhered components. The tolerance and consistency of resultingspacing using the structural adhesive with spacing material may beimproved relative to the use of fasteners 34. In exemplary embodiments,the spacing material may be applied at 2.5% by weight into part or allof the structural adhesive and mixed until substantially homogenous,though any amount may be utilized such as, but not limited to, between0.5% and 10% by weight.

In exemplary embodiments, the structural adhesive may be mixed by acomputer-controlled system 48. The system 48 may comprise one or morereservoirs comprising components of the structural adhesive. The system48 may comprise one or more pumps or other components for drawing orotherwise forcing the components of the structural adhesive together,such as, but not limited to, into a mixing chamber, through one or moretubes, combinations thereof, or the like. The system 48 may comprise, orbe in electronic communication with, one or more temperature sensors,pressure sensors, combinations thereof, or the like, and may adjust anamount, flow rate, percentage, combinations thereof, or the like of thecomponents of the structural adhesive utilized based on readings fromthe sensors.

A component may be placed on a table 38. The component may be a part ofthe first or second heat exchange substructure 20, 22, the housing 18,or another component of the assembly 10 by way of non-limiting example.The table 38 may comprise a substantially planar upper surface toimprove flatness of the resulting subassembly and/or display assembly10. Such placement may be achieved by one or more robots 50. Thecomponents may be retrieved from one or more material carts and/orautonomous guided vehicles (AGVs), including, but not limited to, thoseprovided by AGILOX Systems GmbH (www.agilox.net/en/). The one or morerobots 50 may comprise material handling robots, such as, but notlimited to, those available from FANUC America Corp. of Rochester Hills,MI (www.fanucamerica.com/) though any type or kind of robots 50 may beutilized. In exemplary embodiments, at least some of the one or morerobots 50 may be placed on a track and may have a reach of approximately10 ft.

The component may be secured to the table 38, such as by a vacuum,clamps, static weight, the one or more robots, combinations thereof, orthe like. The table 38 and/or at least one of the one or more robots maybe those available from AXYZ Automation Inc. of Burlington, Ontario,Canada (www.axyz.com/us/) though any type or kind of table 38 may beutilized. In exemplary embodiments, the component secured to the table38 may comprise a front or rear panel 24, 28 of the first heat exchangesubstructure 20B, a front or rear panel 30A, 30B of the second heatexchange substructure 22B, the housing 18 or component thereof,combinations thereof, or the like. However, any component of theassembly 10 may be so secured.

A structural adhesive may be applied to the secured component. Thestructural adhesive, in exemplary embodiments, may be applied by thesystem 48 and/or one or more robots 40. For example, without limitation,the table 38 may comprise one or more gantry-based robots 40 configuredto automatically prepare and/or apply the structural adhesive to desiredlocations on the component. The robots 40 may comprise fluid dispensingrobots in exemplary embodiments.

Additional components may be applied on top of the secured component tofurther complete a subassembly. Alternatively, or additionally, thestructural adhesive may be applied to the non-secured component.Additional applications of structural adhesive may be applied, andadditional components secured as needed to complete the subassembly. Forexample, without limitation, an additional panel 24, 28 of the firstheat exchange substructure 20B may be provided. As another example,without limitation, additional layers 36 and/or panels 30A, 30B may beprovided. In this fashion, one or more components of the assembly 10,such as, but not limited to, the first heat exchange substructure 20and/or the second heat exchange substructure 22, may be manufactured.However, any number, kind, and/or type of components and/orsubstructures for the assembly 10 may be manufactured in this fashion.Furthermore, such completed components and/or substructures may beinstalled at the assembly 10 in this fashion.

Once the final component(s) for the subassembly, or assembly 10, arepositioned, weight may be added. In exemplary embodiments, the weightmay be static weight and may comprise a number of plywood and/or mediumdensity fiberboard sheets stacked atop a polymer sheet. The weights maybe positioned manually, by the one or more robots, a forklift,combinations thereof, or the like. In exemplary embodiments, 1.25lbs./sq. in. of structural adhesive contact area may be applied to agiven subassembly or the assembly 10. This may translate to, forexample, without limitation, approximately 400 lbs. of weight applied todisplay assemblies 10 comprising a 55-inch electronic display layer 14,and approximately 600 lbs. for display assemblies 10 comprising a75-inch electronic display layer 14. However, any ratio may be utilizedsuch as, but not limited to, between 0.5 and 5 lbs./sq. in.

The structural adhesive may be cured. Curing may be accomplished by thepassage of time (e.g., 30-120 mins), the addition of the weights,application of light (e.g., visible spectrum, UV, etc.), application ofan accelerate or other material, exposure to ambient or forced airflow,combination thereof, or the like. In exemplary embodiments, curing maybe accomplished and/or accelerated by exposing the structural adhesiveto particular temperatures, light sources, materials, combinationsthereof, or the like. However, such applications and/or curing may beperformed at room temperature or ambient conditions.

For example, without limitation, considering the first heat exchangesubstructure 20B, the structural adhesive may be applied at locationswhere troughs or ridges of the corrugated layer 26 attach to the panel24, the second panel 28, different portions of the corrugated layer 26,combinations thereof, or the like. If tubes are utilized, the structuraladhesive may be applied at locations where the tubes connect to thepanel 24, the second panel 28, other tubes, combinations thereof, or thelike.

As another example, without limitation, considering the second heatexchange substructure 22B, the structural adhesive may be appliedbetween layers 36, to different portions of the layers 36, at the frontor rear panels 30A, 30B, at the members 32, combinations thereof, or thelike to secure such components to one another.

The structural adhesive may be applied to any component(s) of, and atany location within, the display assembly 10 in any pattern or amount.In exemplary embodiments, the structural adhesive may comprise one ormore pressure sensitive adhesives. The structural adhesive may compriseone or more methyl methacrylate adhesives. The structural adhesive maycomprise those available from PLEXUS Corp., under the PLEXUS® brand ofNeenah, WI (www.plexus.com/en-us/) including, but not limited to, MA8110and/or MA8120 for example, without limitation. Any type or kind ofstructural adhesive may be utilized.

The completed subassembly may be released from the table 38, moved toanother location, and/or joined with other subassemblies (such as by wayof the structural adhesive, though such is not required) to form thedisplay assembly 10. In exemplary embodiments, the completed subassemblymay be joined to other components of the assembly 10 using the same ordifferent structural adhesive, though such is not required. Suchmovement may be made by one or more robots, manually, combinationsthereof, or the like.

The use of structural adhesive in place of fasteners 34 may provide anumber of advantages in the resulting subassembly (e.g., second heatexchange substructure 22B, first heat exchange substructure 20B, orother component) and/or display assembly 10. For example, withoutlimitation, torsional rigidity may be improved, strength may beincreased, noise may be decreased (e.g., from 70 dB to 60 dB),tolerances may be improved, vibrations may be decreased, additionallayers may be added to the second heat exchange substructure 22B and/orfirst heat exchange substructure 20B to increase cooling, sealing may beimproved resulting in a decreased need for cooling, less material and/orlabor may be required for assembly (e.g., 1.25 man hours to 0.6 manhours), holes may not need cut for fasteners 34 resulting in less work,fewer potential leak points, increased strength and rigidity,combinations thereof, and the like. Alternatively, or additionally,dimensional accuracy may be improved by decreasing bond line thicknesses(e.g., from 30/1000ths of an inch to 10/1000ths of an inch) therebyproviding more room, increasing thermal conductivity between components,combinations thereof, and the like. Furthermore, consistency of spacingmay be increased, particularly by use of the spacing material in theadhesive, thereby improvising dimensional accuracy and consistency. Theoverall size of the second heat exchange substructure 22B and/or firstheat exchange substructure 20B, or components thereof (e.g., corrugatedlayer 26 and/or layers 36), may be increased due to the tightenedtolerances and/or increased dimensional accuracy. As yet anotherexample, without limitation, the resulting subassemblies and/or assembly10 may be flatter and may resist bowing, resulting in greater sealingbetween components such as the first heat exchange substructure 20B,which may be provided within an access assembly 44 comprising theelectronic display assembly 14 attached to the housing 18 by way of oneor more hinges 46. This may result in a decreased amount of forcerequired between the access assembly 44 and the housing 18 to maintain aseal with a gasket 42 which may extend between the housing 18 and theaccess assembly.

For example, without limitation, the structural adhesive may be used inplace of other joints and/or to attach other components of the displayassembly 10. In exemplary embodiments, without limitation, thestructural adhesive may be used in fasteners or welding. For example,without limitation, the structural adhesive may be used at corner joints52 of the housing 18, other housings and/or structural members forvarious subassemblies, other components of the display assembly 10,combinations thereof, or the like. An example of where the structuraladhesive may be used at corner joints 52 of the housing 18 is providedat FIG. 11 as an example, without limitation. This may reduce oreliminate the need for welding and subsequent grinding and finishing. Inexemplary embodiments, corner joints for a frame of the access panelsubassembly 44 may be joined by structural adhesive. Welding suchcomponents may result in shrinkage to an hourglass shape making itdifficult to accommodate the cover layer 12. The use of structuraladhesive may reduce or eliminate this problem. For example, four membersmay be formed into a substantially rectangular shape, and the structuraladhesive may be applied at mitered edges of the joint, such as in placeof welding. The members may be secured by clamps, by robots,combinations thereof, or the like, while the structural adhesive cures.This may provide a squarer resulting framework to accommodate a squarercover layer 12. Any number, size, and/or shape members may be used toprovide any type, kind, and/or shape of framework. Adhered componentsmay be subsequently finished, such as by cleaning, surface treatment,further assembly, painting, powder coating, combinations thereof, or thelike, though such is not required.

The various components shown and/or described herein may comprise one ormore metals, polymers, combinations thereof, or the like. In exemplaryembodiments, the various components of the first heat exchangesubstructure 20, the second heat exchange substructure 22, and/orcomponents thereof (e.g., the layers 36, the members 32, and/or thecorrugated layer 26) and/or attached thereto (e.g., the housing 18, thepanel 24, and/or the second panel 28) comprise metal. For example,without limitation, the various components may be cut, pressed, and/orbended sheets of metal, such as steel, aluminum, titanium, combinationsthereof, or the like.

Any embodiment of the present invention may include any of the featuresof the other embodiments of the present invention. The exemplaryembodiments herein disclosed are not intended to be exhaustive or tounnecessarily limit the scope of the invention. The exemplaryembodiments were chosen and described in order to explain the principlesof the present invention so that others skilled in the art may practicethe invention. Having shown and described exemplary embodiments of thepresent invention, those skilled in the art will realize that manyvariations and modifications may be made to the described invention.Many of those variations and modifications will provide the same resultand fall within the spirit of the claimed invention. It is theintention, therefore, to limit the invention only as indicated by thescope of the claims.

Certain operations described herein may be performed by one or moreelectronic devices. Each electronic device may comprise one or moreprocessors, electronic storage devices, executable softwareinstructions, and the like configured to perform the operationsdescribed herein. The electronic devices may be general purposecomputers or a specialized computing device. The electronic devices maycomprise personal computers, smartphones, tablets, databases, servers,or the like. The electronic connections and transmissions describedherein may be accomplished by wired or wireless means. The computerizedhardware, software, components, systems, steps, methods, and/orprocesses described herein may serve to improve the speed of thecomputerized hardware, software, systems, steps, methods, and/orprocesses described herein.

What is claimed is:
 1. A method of increasing thermal conduction in anelectronic display assembly, said method comprising: securing a panelforming part of a thermal management substructure for said electronicdisplay assembly; depositing a structural adhesive on at least one of anelectronic component for operating said electronic display assembly andsaid panel; securing said electronic component directly to a first sideof said panel by way of said adhesive; and securing said thermalmanagement substructure within a housing of said electronic displayassembly such that a second side of said panel defines, at least inpart, at least a portion of an airflow pathway of said electronicdisplay assembly of which said thermal management substructure forms apart.
 2. The method of claim 1 further comprising: activating one ormore fans of said electronic display assembly to move air through saidairflow pathway, including across said second side of said panel toremove heat generated by said electronic component and conducted throughsaid panel.
 3. The method of claim 2 wherein: said airflow pathwayextends between an intake at said housing to an exhaust at said housingto fluidly connect said airflow pathway to an ambient environment. 4.The method of claim 1 further comprising: activating one or more fans ofsaid electronic display assembly to move air through an additionalairflow pathway of said electronic display assembly of which saidthermal management substructure forms a part, including across saidfirst side of said panel and said electronic component, wherein saidadditional airflow pathway is fluidly separated from said airflowpathway at least in part by said panel.
 5. The method of claim 4wherein: said additional airflow pathway extends in a closed loop withinthe housing and is fluidly separated from an ambient environment.
 6. Themethod of claim 1 further comprising: activating a first set of one ormore fans of said electronic display assembly to move ambient airthrough said airflow pathway, including across said second side of saidpanel to remove heat generated by said electronic component andconducted through said panel; and activating a second set of one or morefans of said electronic display assembly to move circulating air througha closed loop airflow pathway of said electronic display assembly ofwhich said thermal management substructure forms a part, includingacross said first side of said panel and said electronic component,wherein said closed loop airflow pathway is fluidly separated from saidairflow pathway at least in part by said panel.
 7. The method of claim 1wherein: said structural adhesive comprises a spacing material of apredetermined size.
 8. The method of claim 7 wherein: said spacingmaterial comprises glass beads.
 9. The method of claim 8 wherein: saidstructural adhesive comprises methyl methacrylate.
 10. The method ofclaim 9 further comprising: preparing said structural adhesive byactivating one or more pumps fluidly connected to a mixing chamber. 11.The method of claim 1 wherein: said step of depositing the structuraladhesive to at least one of the electronic component for operating saidelectronic display assembly and said panel comprises applying thestructural adhesive to both of the electronic component for operatingsaid electronic display assembly and said panel.
 12. The method of claim1 wherein: the electronic display comprises a liquid crystal displaycomprising a backlight; and the thermal management substructure islocated along a rear surface of the backlight when installed.
 13. Themethod of claim 12 wherein: the thermal management substructurecomprises a multi-layer heat exchanger.
 14. The method of claim 1wherein: the steps of depositing the structural adhesive to at least oneof the electronic component for operating said electronic displayassembly and said panel, and securing said electronic component directlyto the first side of said panel by way of said adhesive is performed byone or more robots.
 15. The method of claim 14 wherein: the step ofsecuring the panel forming part of the thermal management substructurefor said electronic display assembly comprises placing the panel at atable and activating a vacuum system of the table.
 16. The method ofclaim 15 further comprising: depositing the structural adhesive at oneor more additional portions of said panel; and placing a second panelatop the panel to secure the panel to the second panel by way of thestructural adhesive.
 17. The method of claim 16 wherein: the panelcomprises peaks and valleys; and the structural adhesive is depositedalong the peaks of the panel.
 18. The method of claim 17 furthercomprising: adding weight to said second panel; and allowing saidstructural adhesive to cure.
 19. A method of increasing thermalconduction in an electronic display assembly, said method comprising:securing a panel forming part of a thermal management substructure forsaid electronic display assembly; robotically depositing a structuraladhesive to at least one of an electronic component for operating saidelectronic display assembly and said panel; robotically securing saidelectronic component directly to a first side of said panel by way ofsaid adhesive; robotically securing said thermal management substructurewithin a housing of said electronic display assembly such that a secondside of said panel defines, at least in part, at least a portion of anairflow pathway of said electronic display assembly of which saidthermal management substructure forms a part; operating said electronicdisplay assembly, including using said electronic component; activatinga first set of one or more fans of said electronic display assembly tomove ambient air through said airflow pathway, including across saidsecond side of said panel to remove heat generated by said electroniccomponent and conducted through said panel; and activating a second setof one or more fans of said electronic display assembly to movecirculating air through a closed loop airflow pathway of said electronicdisplay assembly of which said thermal management substructure forms apart, including across said first side of said panel and said electroniccomponent, wherein said closed loop airflow pathway is fluidly separatedfrom said airflow pathway at least in part by said panel.
 20. A methodof increasing thermal conduction in an electronic display assembly, saidmethod comprising: securing a panel forming part of a thermal managementsubstructure for said electronic display assembly; robotically preparinga structural adhesive comprising glass beads of a predetermined size andmethyl methacrylate; robotically depositing the structural adhesive toat least one of an electronic component for operating said electronicdisplay assembly and said panel; robotically securing said electroniccomponent directly to a first side of said panel by way of saidadhesive; robotically securing said thermal management substructurewithin a housing of said electronic display assembly such that a secondside of said panel defines, at least in part, at least a portion of anairflow pathway of said electronic display assembly of which saidthermal management substructure forms a part; and operating saidelectronic display assembly, including using said electronic component.